Foundry Services
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Our foundry provides end-to-end design, manufacture and qualification for early phase prototypes and high-volume production, supporting up to 100mm wafer sizes on InP, GaAs, GaSb and GaN substrates. We have an extensive portfolio of unique production process IP, essential to high-quality, reliable, volume manufacturing.
FRONT-END-OF-LINE (FEOL)
Design
- 2″, 3″ and 4″ wafers
- All major III-V material systems
- InP, GaAs, GaSb and GaN processing available
- Library of InP epitaxy designs from 1270 – 1650 nm
- Integrated design and manufacturing services for a broad range of photonic devices – FP & DFB lasers, SOAs, RSOAs, Detectors
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Lithography
- E-beam, stepper and contact lithography
- Front to back alignment
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MOCVD
- InP DFB overgrowth
- BH process TBC
- Zinc diffusion TBC
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Wafer Processing
- On wafer etch facet and optical coating technology
- Wet/dry semiconductor and dielectric etching (ICP-RIE/RIE)
- PECVD Passivation (Si3N4/SiO2)
- Evaporated/sputtered metal
- AuSn evaporated solder pads
- Film stress design and balance
- Extensive metrology (including SEM, AFM)x
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We provide custom mechanical feature optimised for hybrid integration to silicon photonic.
BACK-END-OF-LINE (BEOL)
Facet Coating
- AR and HR dielectric optical facet coating at bar level
- High volume capacity with automated bar loading
- Facet coating qualified for non-hermetic packaging
- Wavelength range: 350nm to >3µm
- Reflectivity range: -40dB to 90%
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Testing
- Automated high-volume bar testing
- LIV and spectral testing of edge emitters up to 55°C
- > 2million lasers/month testing capacity
- Chip-on-submounts
- Detailed spectral analysis up to 85°C
- Farfield 2D beam analysis
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Singulation and Assembly
- Automated bar cleave and device singulation
- Typical delivery formats:
- Known-good-dies on tape (6” ring frames)
- Singulated bars on tape (6” ring frames)
- Singulated chips on submounts
- Bars in Gel-Pak
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Reliability & Qualification
- HTOL and ALT testing to Telcordia GR468
- 2k hrs, 5k hrs & 10k hrs test durations
- Continually monitored ACC and APC, individually addressable Newport ILX system
- Up to 500mA, 40°C – 120°C
- Damp-heat testing (typical 85°C/85%)
- Detailed analysis, reliability and qualification reports
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Contact Us
We’d love to show you how Sivers Semiconductors can help transform your business—contact us for further information.